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ISL9R460PF2 July 2003 ISL9R460PF2 4A, 600V StealthTM Diode General Description The ISL9R460PF2 is a StealthTM diode optimized for low loss performance in high frequency hard switched applications. The StealthTM family exhibits low reverse recovery current (IRRM) and exceptionally soft recovery under typical operating conditions. This device is intended for use as a free wheeling or boost diode in power supplies and other power switching applications. The low IRRM and short ta phase reduce loss in switching transistors. The soft recovery minimizes ringing, expanding the range of conditions under which the diode may be operated without the use of additional snubber circuitry. Consider using the StealthTM diode with an SMPS IGBT to provide the most efficient and highest power density design at lower cost. Formerly developmental type TA49408. Features * Soft Recovery . . . . . . . . . . . . . . . . . . . . . . . . . tb / ta > 3 * Fast Recovery . . . . . . . . . . . . . . . . . . . . . . . . . trr < 20ns * Operating Temperature . . . . . . . . . . . . . . . . . . . . 150oC * Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 600V * Avalanche Energy Rated Applications * Switch Mode Power Supplies * Hard Switched PFC Boost Diode * UPS Free Wheeling Diode * Motor Drive FWD * SMPS FWD * Snubber Diode Package TO-220F Symbol K A CATHODE ANODE Device Maximum Ratings Symbol VRRM VRWM VR IF(AV) IFRM IFSM PD EAVL TJ, TSTG TL TPKG TC = 25C unless otherwise noted Ratings 600 600 600 4 8 50 22 10 -55 to 150 300 260 Units V V V A A A W mJ C C C Parameter Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (TC = 108C) Repetitive Peak Surge Current (20kHz Square Wave) Nonrepetitive Peak Surge Current (Halfwave 1 Phase 60Hz) Power Dissipation Avalanche Energy (0.5A, 80mH) Operating and Storage Temperature Range Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s Package Body for 10s, See Techbrief TB334 CAUTION: Stresses above those listed in "Device Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. (c)2003 Fairchild Semiconductor Corporation ISL9R460PF2 Rev. A ISL9R460PF2 Package Marking and Ordering Information Device Marking R460PF2 Device ISL9R460PF2 Package TO-220F Tape Width N/A Quantity 50 Units Electrical Characteristics TC = 25C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off State Characteristics IR Instantaneous Reverse Current VR = 600V TC = 25C TC = 125C 100 1.0 A mA On State Characteristics VF Instantaneous Forward Voltage IF = 4A TC = 25C TC = 125C 2.0 1.6 2.4 2.0 V V Dynamic Characteristics CJ Junction Capacitance VR = 10V, IF = 0A 19 pF Switching Characteristics trr trr IRRM QRR trr S IRRM QRR trr S IRRM QRR dIM/dt Reverse Recovery Time Reverse Recovery Time Maximum Reverse Recovery Current Reverse Recovered Charge Reverse Recovery Time Softness Factor (tb/ta) Maximum Reverse Recovery Current Reverse Recovered Charge Reverse Recovery Time Softness Factor (tb/ta) Maximum Reverse Recovery Current Reverse Recovered Charge Maximum di/dt during tb IF = 1A, dIF/dt = 100A/s, VR = 30V IF = 4A, dIF/dt = 100A/s, VR = 30V IF = 4A, dIF /dt = 200A/s, VR = 390V, TC = 25C IF = 4A, dIF /dt = 200A/s, VR = 390V, TC = 125C IF = 4A, dIF /dt = 400A/s, VR = 390V, TC = 125C 17 19 17 2.6 22 77 4.2 2.8 100 54 3.5 4.3 110 500 20 22 A nC A/s A nC ns ns ns ns A nC ns Thermal Characteristics RJC RJA Thermal Resistance Junction to Case Thermal Resistance Junction to Ambient TO-220F 5.7 70 C/W C/W (c)2003 Fairchild Semiconductor Corporation ISL9R460PF2 Rev. A ISL9R460PF2 Typical Performance Curves TC = 25C unless otherwise noted 8 7 150o C IF, FORWARD CURRENT (A) 6 5 4 100oC 3 2 1 0 0 0.5 1 1.5 2 2.5 3 VF, FORWARD VOLTAGE (V) 0.1 100 IR, REVERSE CURRENT (A) 25oC 100 150o C 125oC 10 100o C 600 75oC 1 25oC 200 300 400 500 600 VR , REVERSE VOLTAGE (V) Figure 1. Forward Current vs Forward Voltage 90 VR = 390V, TJ = 125oC 80 tb AT dIF/dt = 200A/s, 500A/s, 800A/s 70 t, RECOVERY TIMES (ns) 60 50 40 30 20 10 0 1 ta AT dIF/dt = 200A/s, 500A/s, 800A/s 2 3 4 5 6 7 8 Figure 2. Reverse Current vs Reverse Voltage 120 VR = 390V, TJ = 125oC 100 t, RECOVERY TIMES (ns) tb AT IF = 8A, 4A, 2A 80 60 40 ta AT IF = 8A, 4A, 2A 20 0 100 200 300 400 500 600 700 800 900 1000 IF, FORWARD CURRENT (A) dI F /dt, CURRENT RATE OF CHANGE (A/s) Figure 3. ta and tb Curves vs Forward Current IRRM , MAX REVERSE RECOVERY CURRENT (A) VR = 390V, TJ = 125oC 7 dIF/dt = 800A/s IRRM , MAX REVERSE RECOVERY CURRENT (A) 8 8 Figure 4. ta and tb Curves vs dIF/dt VR = 390V, TJ = 125oC 7 6 IF = 4A 5 4 3 2 1 100 200 300 400 500 600 700 800 900 1000 dIF /dt, CURRENT RATE OF CHANGE (A/s) IF = 2A IF = 8A 6 5 dIF/dt = 500A/s 4 3 dIF/dt = 200A/s 2 1 2 3 4 5 6 7 8 IF, FORWARD CURRENT (A) Figure 5. Maximum Reverse Recovery Current vs Forward Current Figure 6. Maximum Reverse Recovery Current vs dIF/dt (c)2003 Fairchild Semiconductor Corporation ISL9R460PF2 Rev. A ISL9R460PF2 Typical Performance Curves TC = 25C unless otherwise noted 6 S, REVERSE RECOVERY SOFTNESS FACTOR QRR, REVERSE RECOVERY CHARGE (nC) VR = 390V, TJ = 125o C 5 180 VR = 390V, TJ = 125o C 160 IF = 8A 4 IF = 4A IF = 8A 140 IF = 4A 120 3 IF = 2A 2 100 IF = 2A 80 1 100 200 300 400 500 600 700 800 900 1000 60 100 200 300 400 500 600 700 800 900 1000 dIF /dt, CURRENT RATE OF CHANGE (A/s) dIF /dt, CURRENT RATE OF CHANGE (A/s) Figure 7. Reverse Recovery Softness Factor vs dIF/dt 1800 1600 CJ , JUNCTION CAPACITANCE (pF) 1400 1200 1000 800 600 400 200 0 0.03 Figure 8. Reverse Recovery Charge vs dIF/dt 5 IF(AV) , AVERAGE FORWARD CURRENT (A) 0.1 1.0 10 100 4 3 2 1 0 100 110 120 130 140 150 VR , REVERSE VOLTAGE (V) TC , CASE TEMPERATURE (OC) Figure 9. Junction Capacitance vs Reverse Voltage Figure 10. DC Current Derating Curve 2 1 DUTY CYCLE - DESCENDING ORDER 0.5 0.2 0.1 0.05 0.02 0.01 PDM 0.1 t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJC x RJC + TC 10-3 10-2 t, RECTANGULAR PULSE DURATION (s) 10-1 100 101 ZJC, NORMALIZED THERMAL IMPEDANCE SINGLE PULSE 0.01 10-5 10-4 Figure 11. Normalized Maximum Transient Thermal Impedance (c)2003 Fairchild Semiconductor Corporation ISL9R460PF2 Rev. A ISL9R460PF2 Test Circuit and Waveforms VGE AMPLITUDE AND RG CONTROL dIF/dt t1 AND t2 CONTROL IF L IF DUT RG CURRENT SENSE + MOSFET VDD 0 0.25 IRM IRM dIF dt ta trr tb VGE t1 t2 - Figure 12. Itrr Test Circuit Figure 13. trr Waveforms and Definitions I = 0.5A L = 80mH R < 0.1 VDD = 200V E AVL = 1/2LI2 [VR(AVL) /(V R(AVL) - V DD)] Q 1 = IGBT (BVCES > DUT VR(AVL)) L CURRENT SENSE Q1 V DD DUT R + V DD IV VAVL IL IL t0 t1 t2 t Figure 14. Avalanche Energy Test Circuit Figure 15. Avalanche Current and Voltage Waveforms (c)2003 Fairchild Semiconductor Corporation ISL9R460PF2 Rev. A TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM FACTTM ActiveArrayTM FACT Quiet SeriesTM BottomlessTM FAST(R) CoolFETTM FASTrTM CROSSVOLTTM FRFETTM DOMETM GlobalOptoisolatorTM EcoSPARKTM GTOTM E2CMOSTM HiSeCTM I2CTM EnSignaTM Across the board. Around the world.TM The Power FranchiseTM Programmable Active DroopTM DISCLAIMER ImpliedDisconnectTM ISOPLANARTM LittleFETTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic(R) TruTranslationTM UHCTM UltraFET(R) VCXTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Preliminary No Identification Needed Full Production Obsolete Not In Production Rev. I3 |
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